Ductile grinding processing for the diamond or diamond film

ABSTRACT

The present invention is to provide a kind of a ductile grinding processing technique for the diamond material, wherein it comprises of: after giving a heat energy to heat the diamond material, there gives a force to the heated diamond material, and by giving a heat and a force it is able to proceed a ductile grinding processing technique for the diamond material; for the diamond film to proceed a ductile grinding processing technique comprises of: there gives a heat energy to heat the diamond film, and then grinds the heated diamond material with a grinding wheel, and by use of heating and grinding with a grinding wheel it is able to proceed a ductile grinding processing technique for the diamond material.

BACKGROUND OF INVENTION

[0001] 1. Field of Invention

[0002] The present invention is to provide a kind of a ductile grindingprocessing technique for the diamond material, wherein by giving a heatand an appropriate force methods it is able to proceed a ductilegrinding processing technique for the diamond material, and to reducethe cost as well as the possibility of the failure of process.

[0003] 2. Description of the Prior Art

[0004] At present, the mobile communication system is a modern property,for example: cellular phone, bluetooth module, mobile network browser,global position system (GPS), personal digital assistant (PDA), and B.B. Call, etc. are modern products in the mobile communication system,and they all have demands for high frequency and high electricendurance. According to this trend, therefore on the diamond film byusing sputtering method or chemical vapor deposition (CVD) method itforms a polycrystal ZnO piezoelectric film, through the fastertransporting rate of surface acoustic wave (SAW) it increases theminimum of line width of an electrode demand on the wave filter chip forthe high frequency of SAW.

[0005] Traditional processing diamond proceeds with a lapping processmethod. Owing to the highest toughness of diamond, it belongs to anextremely difficult be processed material, by using this processingmethod it is necessary to employ an extremely high pressure and longtime, therefore the processing cost is pretty high. Hence, there employsto use chemicals or to flow other gases to heat the apparatus, and thediamond molecular structure can be relatively damaged, but no matter ofemploying chemicals or gases it needs the repeatedly treatment processesand the complicated mechanical equipments, and also it causes theprocessing environment be poor and polluted, and increases the cost.

[0006] No matter of using a lapping method or using chemicals, gases,and heating methods process, it is still necessary to perform a lappingprocess for a diamond to make the diamond surface be smooth and flat.Not only there increases one more of the lapping process cost, but alsoafter the first processing treatment the diamond film becomes muchthinner and more fragile. Therefore, this process for the diamondsurface being smooth and flat would increase the risk of the diamondfilm cracking.

[0007] In order to reduce the risk of the diamond film cracking, thereemploys plasma, ion beam, or excimer laser etc. to perform theprocessing treatment for the diamond film, however, the cost of themethod be used is too high and also the energy is consumed very much.

SUMMARY OF THE INVENTION

[0008] Hence, the aim of the present invention is to solve the drawbacksdescribed above. In order to avoid the presence of the drawbacksdescribed above, the present invention is to provide a kind of a ductilegrinding processing technique for the diamond material, wherein it canreduce the pressure needed of the manufacturing process.

[0009] The other aim of the present invention is to provide a kind of aductile grinding processing technique for the diamond material, whereinit can reduce the time performed of the manufacturing process.

[0010] The other aim of the present invention is to provide a kind of aductile grinding processing technique for the diamond material, whereinit can simplify the procedures of the manufacturing process.

[0011] The other aim of the present invention is to provide a kind of aductile grinding processing technique for the diamond material, whereinit can reduce the pollution produced from the manufacturing process.

[0012] The other aim of the present invention is to provide a kind of aductile grinding processing technique for the diamond material, whereinit can save the cost of the manufacturing process.

[0013] In order to obtain the aims described above, the presentinvention refers to using a heat energy to heat the diamond film andgrinding the heated diamond material with a grinding wheel, throughheating and grinding with a grinding wheel it is able to proceed aductile grinding processing technique for the diamond material; for thediamond material after there gives a heat energy to heat the heateddiamond material, there gives a force to its heated diamond material,through giving a heat and force there proceeds a ductile grindingprocess for the diamond material, it can reduce the pressure, time, andpollution of lapping, and simplify the grinding process to save the costof manufacturing process.

BRIEF DESCRIPTION OF THE DRAWINGS

[0014]FIG. 1 illustrates the grinding process scheme of the presentinvention.

[0015]FIG. 2 illustrates the applied scheme of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0016] A ductile grinding processing technique for the diamond filmrefers to producing the heat of power with 20W˜1000W heat energy byusing a physical or chemical method to heat the diamond film, andgrinding the heated diamond material with a grinding wheel, which iscomposed of diamond catalyst (ex. iron or nickel) and diamond or cBNhard material abrasives, by using computer program or kinematicmechanism to control the calculated feeding amount of 0.05˜5 μm, throughheating and grinding with a grinding wheel it is able to proceed aductile grinding processing technique for the diamond material.

[0017] A ductile grinding processing technique for the diamond materialcomprises of: providing the heat of power with 20W˜1500W heat energy byusing a physical or chemical method to heat the diamond material, andgiving a force to the heated diamond material by using an appropriatemethod such as hydraulic pressure, oil pressure, pneumatic pressure, andkinematic mechanism etc., through giving a heat and a force it is ableto proceed a ductile grinding processing technique for the diamondmaterial.

[0018]FIG. 1 illustrates the grinding process scheme of the presentinvention. By using laser 3 there preheats the diamond film 11 andsubstrate 12 to increase the temperature, before entering into a ductilegrinding region there obtains the much higher energy, after enteringinto a grinding wheel processing region, there utilizes a grinding wheel2, which is composed of diamond catalyst (ex. iron or nickel) anddiamond or cBN hard material abrasives, and controls the feeding amountof a grinding wheel 2 processing equipment, there controls anappropriate feeding amount in a ductile grinding region to prevent thefragile region of proceeding a ductile grinding for the diamond film,and to reduce the problems of the diamond cracking.

[0019] By using laser 3 there preheats the processed diamond film 11, itnot only removes other impurities on the diamond film 11 surface withheat, but also after a ductile grinding processing the loosing structureof the diamond film 11 surface rearranges the arrays to recover itscharacteristic.

[0020]FIG. 2 illustrates the applied scheme of the present invention.For a large area of the diamond film 11 or a large volume of the diamondmaterial there proceeds ductile grinding, which is by using one orplural groups of laser to proceed heating to prevent anisotropic heatingdue to area or volume, or to lose the heat energy rapidly.

[0021] The present invention specially discloses and describes selectedthe best examples. It is to be understood, however, that the presentinvention is not limited to the specific features shown and described.The invention is claimed in any forms or modifications within the spiritand the scope of the appended claims.

What is claimed is:
 1. A kind of a ductile grinding processing for thediamond or diamond film, comprsing: provides a heat energy to heat thediamond film; grinds the heated diamond material with a grinding wheel;and by use of heating and grinding with a grinding wheel there proceedsa ductile grinding process for the diamond material.
 2. A ductilegrinding process for the diamond material of claim 1, wherein said theheat source can be a physical or chemical method.
 3. A ductile grindingprocess for the diamond material of claim 1, wherein said the powerproduced by heating is 20W˜1000W.
 4. A ductile grinding process for thediamond material of claim 1, wherein said the grinding feeding amount is0.05˜5 μm.
 5. A ductile grinding process for the diamond material ofclaim 1, wherein said the grinding feeding amount can be controlled bythe computer program or the kinematic mechanism.
 6. A ductile grindingprocess for the diamond material of claim 1, wherein said a grindingwheel is composed of the diamond catalyst and the abrasives.
 7. Aductile grinding process for the diamond material of claim 6, whereinsaid the diamond catalyst is selected from iron and nickel.
 8. A ductilegrinding process for the diamond material of claim 6, wherein said anabrasive is selected from diamond and cBN hard materials.
 9. A kind of aductile grinding processing for the diamond material, comprsing:provides a heat energy to heat the diamond material; gives a force tothe heated diamond material; and by giving a heat and a force thereproceeds a ductile grinding process for the diamond material.
 10. Aductile grinding process for the diamond material of claim 9, whereinsaid the heat source can be a physical or chemical method.
 11. A ductilegrinding process for the diamond material of claim 9, wherein said thepower produced by heating is 20W˜1500W.
 12. A ductile grinding processfor the diamond material of claim 9, wherein said a giving force methodcan be hydraulic pressure, oil pressure, pneumatic pressure, andkinematic mechanism.
 13. A ductile grinding process for the diamondmaterial of claim 12, wherein said the kinematic mechanism method can bea grinding wheel processing.
 14. A ductile grinding process for thediamond material of claim 13, wherein said the grinding feeding amountcan be calculated and controlled by the computer program or thekinematic mechanism.
 15. A ductile grinding process for the diamondmaterial of claim 13, wherein said a grinding wheel is composed of thediamond catalyst and the abrasives.
 16. A ductile grinding process forthe diamond material of claim 15, wherein said the diamond catalyst isselected from iron and nickel.
 17. A ductile grinding process for thediamond material of claim 15, wherein said an abrasive is selected fromdiamond and cBN hard materials.